Three-dimensional contact response analysis of thermoelectric thin film under multiple physical fields
Mathematics and Mechanics of Solids
Published online on September 04, 2025
Abstract
Mathematics and Mechanics of Solids, Ahead of Print.
This study establishes a three-dimensional frictionless contact model for the rigid indenter and the thermoelectric thin film under multiple physical fields. By combining the Navier–Cauchy equations, the Fourier heat conduction equation, and the ...
This study establishes a three-dimensional frictionless contact model for the rigid indenter and the thermoelectric thin film under multiple physical fields. By combining the Navier–Cauchy equations, the Fourier heat conduction equation, and the ...