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Heat dissipation performance of nanofluid flowing in microchannels of chips

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Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering

Published online on

Abstract

Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, Ahead of Print.
Thermal management severely limits performance improvements and the integration of high-power chips. To improve the comprehensive performance of microchannel heat sinks, a multi-criteria thermodynamic evaluation framework, which integrates heat transfer ...