The objective of this paper is to investigate the high-speed wheel/rail adhesion under interfacial liquids contamination using a numerical model. This model considers the rheological property of interfacial liquids, elastic-plastic deformation of microasperities contact and the temperature across the film thickness. The pressure and the temperature fields can be obtained. The effects of train speed, surface roughness parameters, characteristic shear stress, and the slip ratio are investigated. Furthermore, the present model is compared with the elastic model and the elastic-plastic model without considering the thermal effect. The numerical results show that the train speed and temperature affects the wheel/rail adhesion significantly.